Accueil - Prochains événements - Redefining electronic boundaries with 3D integration and advanced packaging Redefining electronic boundaries with 3D integration and advanced packaging 05/09/2024  14:00-16:00 Séminaire Général INLPerceval COUDRAIN (CEA-LETI, Grenoble) Site ECL, Bâtiment W1, Amphithéâtre 201