3D monolithically integrated SPAD pixels in advanced CMOS FDSOI technology

SPAD FD-SOI

Research team & project organization

SPAD-FDSOI program is proposed by INL (coordinator), ICube and CEA-LETI (DCOS).

  • INL (Institut des Nanotechnologies de Lyon), CNRS joint laboratory (UMR5270) attached to the Université de Lyon (especially INSA Lyon, Ecole Centre de Lyon, Université Claude Bernard Lyon 1, Chimie - Physique - Electronique)

INL has in particular a long experience of innovation in the field of micro-nano-electronic devices, 3D integrated devices, nanophotonics, sensors and associated electronics e.g. design of CMOS multi-buried junction photodetectors, the design of real-time patient dosimeters (patent), SPAD architecture since 2014 (through the EU project INFIERI and more recently a regional research program).
INL scientific coordinator: Francis Calmon.
Involved persons: F. Calmon (Pr), P. Pittet (IR), R. Cellier (McF), R. Orobtchouk (McF), C. Malhaire (McF), T. Chaves de Albuquerque (PhD student), D. Issartel (PhD student).

  • ICube (laboratoire des sciences de l'ingénieur, de l'informatique et de l'imagerie), CNRS joint laboratory (UMR7357) attached to the Université de Strasbourg.

ICube, especially the Heterogeneous System and Microsystem team, has a strong experience in high speed imaging and its application to optical biomedical imaging. In particular, this team designed some ultrafast CMOS imagers for sub-nanosecond time resolved imaging such as streak camera and SPAD based time correlated photon counting system. Its design expertise extends from the sensor and the associated electronics, up to the complete camera system and its characterization.
ICube scientific coordinator: Wilfried Uhring.
Involved persons: W. Uhring (Pr), J.P. Kammerer (McF), J.P. Le Normand (McF), N. Dumas (McF), J. Bartringer (IE), L. Hebrard (Pr).

  • CEA-LETI

CEA-LETI-DCOS has developed a strong expertise in the field of 3D integration from specific 3D technology (TSV, interconnections, design, stacking…) up to the complete 3D integrations in prototypes.
CEA-LETI scientific coordinator: Gabriel Parès.

The program is organized with three scientific work packages WP1-2-3.

Work package 

Description

INL

ICube

LETI

WP 1
SPAD pixel: simulations, modeling and predictive tools

SPAD model (TCAD simulations), development of predictive tools (analytical model with post-TCAD calculations of DCR, PDP, jitter)

MC

SC

 

Improvement of PDP in BSI: implementation of “light trapping” concepts (back-side illumination)

MC

 

 

SPAD pixel layout in C28FDSOI

MC

SC

 

WP 2
Prototypes: design and characterization

SPAD array and associated electronics design (SPAD pixel)
IC design / tape-out of prototypes (4 ICs are planned)

SC

MC

 

Static and dark SPAD characterizations (breakdown voltage, electrical field map by electroluminescence, DCR, after-pulsing)

SC

MC

 

Illuminated and dynamic SPAD characterizations (PDP, jitter)

SC

MC

 

WP 3
Post-processing on prototypes for BSI

Prototype fabrication (MPW run), BSI post-processing: die thinning / assembly

 

 

MC

Additional technological steps for the implementation of the light trapping concept

MC

 

SC

Table: work packages – tasks and implication of the partners (MC: Main Contributor – SC: Secondary Contributor).